Title :
Built-in via module test structure for backend interconnection in-line process monitor
Author :
Li, H.Y. ; Li, W.H. ; Wong, L.Y. ; Hwang, N.
Author_Institution :
Inst. of Microelectron., Singapore
fDate :
27 June-1 July 2005
Abstract :
The best in-line process monitoring test structure should have multiple purposes, one of which is to allow easy assessing and quick defect identification. In this study, the via module test structure has been designed allowing easy assessment of the via profiles of via, coupled with the resistance measurement of the via, such can be used as effect via module defect monitor. This structure can be used as frame monitor structure. Via module test structure is realized in Cu/low K (Black Diamond ™) interconnection.
Keywords :
built-in self test; fault diagnosis; integrated circuit interconnections; process monitoring; Cu; built-in via module test structure; defect identification; frame monitor structure; in-line process monitoring test structure; low k interconnection; module defect monitoring; resistance measurement; via profiles; Brightness; Detectors; Electric resistance; Electric variables measurement; Electrical resistance measurement; Joining processes; Microelectronics; Monitoring; Process control; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469154
