DocumentCode
3549744
Title
The effect of ultrasonic cleaning on the bond wires
Author
Jiang YuQi ; Tang Dong ; Song Xianzhong
Author_Institution
Lam Tim Fai Sponsion (China) Ltd., Suzhou, China
fYear
2005
fDate
27 June-1 July 2005
Firstpage
237
Lastpage
241
Abstract
Cracks or fractures were found at the heel of bond wire after decapsulation and subsequent ultrasonic cleaning. No such cracking was found prior to cleaning. The effect of ultrasonic cleaning on the bond wire was simulated and analysed using finite element analysis (FEA). The results show that the heel crack is likely induced by resonant vibration of the bond wire.
Keywords
cracks; finite element analysis; fracture; lead bonding; multichip modules; semiconductor device breakdown; ultrasonic cleaning; FEA; bond wires; cracks; decapsulation; finite element analysis; fractures; heel crack; resonant vibration; ultrasonic cleaning; Bonding; Cleaning; Finite element methods; Frequency; Gold; Semiconductor device packaging; Solvents; Surface cracks; Vibrations; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN
0-7803-9301-5
Type
conf
DOI
10.1109/IPFA.2005.1469170
Filename
1469170
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