Title :
The effect of ultrasonic cleaning on the bond wires
Author :
Jiang YuQi ; Tang Dong ; Song Xianzhong
Author_Institution :
Lam Tim Fai Sponsion (China) Ltd., Suzhou, China
fDate :
27 June-1 July 2005
Abstract :
Cracks or fractures were found at the heel of bond wire after decapsulation and subsequent ultrasonic cleaning. No such cracking was found prior to cleaning. The effect of ultrasonic cleaning on the bond wire was simulated and analysed using finite element analysis (FEA). The results show that the heel crack is likely induced by resonant vibration of the bond wire.
Keywords :
cracks; finite element analysis; fracture; lead bonding; multichip modules; semiconductor device breakdown; ultrasonic cleaning; FEA; bond wires; cracks; decapsulation; finite element analysis; fractures; heel crack; resonant vibration; ultrasonic cleaning; Bonding; Cleaning; Finite element methods; Frequency; Gold; Semiconductor device packaging; Solvents; Surface cracks; Vibrations; Wire;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469170
