Title :
Study of degradations in PCB interconnections for high frequency applications
Author :
Duchamp, G. ; Verdier, F.J.M. ; Levrier, B. ; Marc, F. ; Ousten, Y. ; Danto, Y.
Author_Institution :
Lab. KL-ENSEIRB, Univ. Bordeaux, Talence, France
fDate :
27 June-1 July 2005
Abstract :
In this paper, we investigate a second-category method to evaluate the degradations of high frequency interconnections on FR4 boards. More than the defects location, the purpose of the present study is to distinguish the effects of the copper metallization corrosion (oxidation, delamination, etc..) from the ετ sensitivity to moisture absorption of the laminated substrate. The test structures are based on elementary resonant circuits, which have been submitted to different accelerated aging tests. The resonance characteristics of these structures are very sensitive to the technological parameters and allow an early detection of damages.
Keywords :
failure analysis; fault diagnosis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; printed circuits; radiofrequency integrated circuits; FR4 boards; PCB interconnections degradations; aging tests; copper metallization corrosion; damages detection; defects location; delamination; elementary resonant circuits; high frequency interconnections; laminated substrate; moisture absorption; oxidation; test structures; Circuit testing; Copper; Corrosion; Degradation; Delamination; Frequency; Integrated circuit interconnections; Metallization; Moisture; Oxidation;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469173
