Study of degradations in PCB interconnections for high frequency applications

Author

Duchamp, G. ; Verdier, F.J.M. ; Levrier, B. ; Marc, F. ; Ousten, Y. ; Danto, Y.

Author_Institution

Lab. KL-ENSEIRB, Univ. Bordeaux, Talence, France

fYear

2005

fDate

27 June-1 July 2005

Firstpage

253

Lastpage

257

Abstract

In this paper, we investigate a second-category method to evaluate the degradations of high frequency interconnections on FR4 boards. More than the defects location, the purpose of the present study is to distinguish the effects of the copper metallization corrosion (oxidation, delamination, etc..) from the ετ sensitivity to moisture absorption of the laminated substrate. The test structures are based on elementary resonant circuits, which have been submitted to different accelerated aging tests. The resonance characteristics of these structures are very sensitive to the technological parameters and allow an early detection of damages.

Keywords

failure analysis; fault diagnosis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; printed circuits; radiofrequency integrated circuits; FR4 boards; PCB interconnections degradations; aging tests; copper metallization corrosion; damages detection; defects location; delamination; elementary resonant circuits; high frequency interconnections; laminated substrate; moisture absorption; oxidation; test structures; Circuit testing; Copper; Corrosion; Degradation; Delamination; Frequency; Integrated circuit interconnections; Metallization; Moisture; Oxidation;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the

Print_ISBN

0-7803-9301-5

Type

conf

DOI

10.1109/IPFA.2005.1469173

Filename

1469173