Title :
Ring voids and solder extrusion mechanism for flip chip packaging
Author :
Zhao, X.L. ; Chin, J.M. ; Master, Raj N.
Author_Institution :
Device Anal. Lab, Adv. Micro Devices (Singapore) Pte Ltd, Singapore
fDate :
27 June-1 July 2005
Abstract :
This paper investigated the factors to cause the formation of underfill voids during dispense and cure of underfill in the flip chip technique. The extrusion mechanism of solder bump has been studied in detail. The experimental results show that additional interim-cure processing is an effective way to eliminate ring voids.
Keywords :
curing; extrusion; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; solders; voids (solid); flip chip packaging; integrated circuit interconnections; integrated circuit packaging; ring voids; solder bumps; solder extrusion mechanism; underfill curing; underfill dispensing; underfill voids; Assembly; Fatigue; Flip chip; Lead; Microprocessors; Plastic packaging; Pulp manufacturing; Temperature distribution; Testing; US Department of Energy;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469174
