Title :
Failure localization in IC packages using time domain reflectometry: technique limitations and possible improvements
Author :
Abessolo-Bidzo, Dolphin ; Poirier, Patrick ; Descamps, Philippe ; Domengès, Bernadette
Author_Institution :
LaMIP, Philips Semicond., Cedex, France
fDate :
27 June-1 July 2005
Abstract :
Our case study has shown the efficiency of isolating failing sites (shorts, opens) in IC packages using TDR and especially sequential comparative TDR analysis, which allowed to overcome some of TDR hardware limitations and to identify the different regions of the DUT. Currently, it´s possible to increase the bandwidth of the main standard TDR sources available on the market up to 70 GHz, but the main limitation is due to TDR probes which best bandwidth only reaches 20 GHz. Anyway, TDR technique has already proved to definitively take up its own place in the non-destructive failure analysis flow of FA labs beside SCAT and x-ray ones for most of common IC packages used in semiconductors industry.
Keywords :
failure analysis; integrated circuit packaging; integrated circuit reliability; time-domain reflectometry; DUT; IC package; SCAT; TDR hardware limitation; TDR technique; failure localization; nondestructive failure analysis; sequential comparative TDR analysis; time domain reflectometry; Bandwidth; Failure analysis; Impedance; Integrated circuit packaging; Packaging machines; Pins; Reflection; Reflectometry; Semiconductor device packaging; Wire;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469187
