Title :
Failure analysis of lead-free Sn-Ag-Cu solder joints for 316 I/O PBGA package
Author :
Xu, Luhua ; Pang, John H L ; Faxing, Che
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore
fDate :
27 June-1 July 2005
Abstract :
Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. Experimental strain analysis using the digital image speckle analysis (DISA) method is capable of measuring the strain concentration at the corner of the solder joint where thermal fatigue cracks initiate and propagate. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu soldered assembly was subject to a temperature ramp from room temperature of 25 °C to 125 °C. The failure site agrees with the high strain locations measured by DISA.
Keywords :
assembling; ball grid arrays; copper alloys; deformation; failure analysis; fatigue cracks; plastic packaging; silver alloys; solders; speckle; tin alloys; DISA method; Micro-DISC; PBGA assembly; PBGA package; SnAgCu; digital image speckle analysis; failure analysis; lead-free solder joints; micro-deformation; micro-digital image speckle correlation system; plastic ball grid array; strain analysis; thermal cycling; thermal fatigue cracks; Assembly; Environmentally friendly manufacturing techniques; Failure analysis; Image analysis; Lead; Packaging; Soldering; Speckle; Strain measurement; Temperature;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the
Print_ISBN :
0-7803-9301-5
DOI :
10.1109/IPFA.2005.1469188
