• DocumentCode
    3549778
  • Title

    HfO2/metal stacks: determination of energy level diagram, work functions & their dependence on metal deposition

  • Author

    Zafar, S. ; Narayanan, V. ; Callegari, A. ; McFeely, F.R. ; Jamison, P. ; Gusev, E. ; Cabral, C., Jr. ; Jammy, R.

  • Author_Institution
    Res. Div., IBM Semicond. Res. & Dev. Center, Yorktown Heights, NY, USA
  • fYear
    2005
  • fDate
    14-16 June 2005
  • Firstpage
    44
  • Lastpage
    45
  • Abstract
    We report the following results for metal/HfO2/oxide stacks, (i) The energy level band diagram of HfO2/SiO2 stacks is experimentally determined for the first time; the conduction band offset between HfO2 and interfacial SiO2 is estimated to be 2.05 eV. (ii) Work functions of W, Re and TaSiN are measured for HfO2/SiO2/Si and SiO2/Si stacks: work functions exhibit no Fermi pinning effect in HfO2, unlike previous report by Schaeffer et al in 2004. (iii) The impact of metal gate deposition on its work function and the oxide charge density is investigated. Measurements show that the tungsten work function is independent of deposition time and method (CVD vs. sputtering). However, oxide charge density (Q0X) depends both on the deposition time and method: Q0X is positively charged for CVD and negatively charged for sputtered depositions. Also, Q0X increases with W deposition time.
  • Keywords
    CVD coatings; MOS capacitors; hafnium compounds; metal-insulator boundaries; rhenium; silicon; silicon compounds; tantalum compounds; tungsten; vapour deposited coatings; work function; CVD; Fermi pinning effect; HfO2-SiO2-Si; Re; SiO2-Si; TaSiN; W; conduction band offset; deposition time; energy level band diagram; metal gate deposition; metal oxide stacks; oxide charge density; sputtered depositions; tungsten work function; Capacitors; Elementary particle vacuum; Energy measurement; Energy states; Hafnium oxide; Paper technology; Thickness measurement; Threshold voltage; Vacuum technology; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on
  • Print_ISBN
    4-900784-00-1
  • Type

    conf

  • DOI
    10.1109/.2005.1469205
  • Filename
    1469205