DocumentCode :
3549778
Title :
HfO2/metal stacks: determination of energy level diagram, work functions & their dependence on metal deposition
Author :
Zafar, S. ; Narayanan, V. ; Callegari, A. ; McFeely, F.R. ; Jamison, P. ; Gusev, E. ; Cabral, C., Jr. ; Jammy, R.
Author_Institution :
Res. Div., IBM Semicond. Res. & Dev. Center, Yorktown Heights, NY, USA
fYear :
2005
fDate :
14-16 June 2005
Firstpage :
44
Lastpage :
45
Abstract :
We report the following results for metal/HfO2/oxide stacks, (i) The energy level band diagram of HfO2/SiO2 stacks is experimentally determined for the first time; the conduction band offset between HfO2 and interfacial SiO2 is estimated to be 2.05 eV. (ii) Work functions of W, Re and TaSiN are measured for HfO2/SiO2/Si and SiO2/Si stacks: work functions exhibit no Fermi pinning effect in HfO2, unlike previous report by Schaeffer et al in 2004. (iii) The impact of metal gate deposition on its work function and the oxide charge density is investigated. Measurements show that the tungsten work function is independent of deposition time and method (CVD vs. sputtering). However, oxide charge density (Q0X) depends both on the deposition time and method: Q0X is positively charged for CVD and negatively charged for sputtered depositions. Also, Q0X increases with W deposition time.
Keywords :
CVD coatings; MOS capacitors; hafnium compounds; metal-insulator boundaries; rhenium; silicon; silicon compounds; tantalum compounds; tungsten; vapour deposited coatings; work function; CVD; Fermi pinning effect; HfO2-SiO2-Si; Re; SiO2-Si; TaSiN; W; conduction band offset; deposition time; energy level band diagram; metal gate deposition; metal oxide stacks; oxide charge density; sputtered depositions; tungsten work function; Capacitors; Elementary particle vacuum; Energy measurement; Energy states; Hafnium oxide; Paper technology; Thickness measurement; Threshold voltage; Vacuum technology; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on
Print_ISBN :
4-900784-00-1
Type :
conf
DOI :
10.1109/.2005.1469205
Filename :
1469205
Link To Document :
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