Title :
HfSiON gate dielectrics design for mixed signal CMOS
Author :
Kojima, K. ; Iijima, R. ; Ohguro, T. ; Watanabe, T. ; Takayanagi, M. ; Momose, H.S. ; Tshimaru, K. ; Ishiuchi, H.
Author_Institution :
SoC Res. & Dev. Center, Toshiba Corp. Semicond. Co., Yokohama, Japan
Abstract :
HfSiON is one of the most promising alternative gate dielectric materials for low standby power (LSTP) application. Recently, DC performance, gate leakage current, and reliability have been reported by T. Watanabe et al in 2004. However, study of analog performances of CMOS with HfSiON gate dielectrics is not sufficient. In this paper, we discuss 1/f noise and matching of CMOS with HfSiON gate dielectrics and predict trends in Svg with technology scaling according to the ITRS roadmap based on Mikoshiba´s model. The HfSiON dielectric condition for mixed signal CMOS were investigated. In order to satisfy 1/f noise (Svg) requirement from ITRS roadmap beyond hp65nm, the Nt must be below 1.5 × 1017 cm-3eV-1. The results of Vth matching were excellent even when HfSiO gate dielectric was applied to MOSFET.
Keywords :
1/f noise; CMOS integrated circuits; MOCVD coatings; MOSFET; dielectric materials; hafnium compounds; mixed analogue-digital integrated circuits; nanotechnology; silicon compounds; 1/f noise; CMOS analog performance; DC performance; HfSiON; MOSFET; Mikoshiba model; Vth matching; gate dielectric materials; gate dielectrics design; gate leakage current; low standby power; mixed-signal CMOS; reliability; Degradation; Dielectrics; Electrodes; Fluctuations; Hafnium; Leakage current; MOS devices; MOSFETs; Semiconductor device noise; Signal design;
Conference_Titel :
VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on
Print_ISBN :
4-900784-00-1
DOI :
10.1109/.2005.1469211