DocumentCode :
3549805
Title :
Tall triple-gate devices with TiN/HfO2 gate stack
Author :
Collaert, N. ; Demand, M. ; Ferain, I. ; Lisoni, J. ; Singanamalla, R. ; Zimmerman, P. ; Yim, Y.S. ; Schram, T. ; Mannaert, G. ; Goodwin, M. ; Hooker, J.C. ; Neuilly, F. ; Kim, M.C. ; De Meyer, K. ; De Gendt, S. ; Boullart, W. ; Jurezak, M. ; Biesemans, S
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2005
fDate :
14-16 June 2005
Firstpage :
108
Lastpage :
109
Abstract :
We demonstrate for the first time the performance of aggressively scaled triple gate devices with a MOCVD TiN/HfO gate stack. The transistors have physical gate lengths down to 40 nm, and 60 nm tall and 10 nm wide fins. We show that MOCVD TiN can be used to successfully set the threshold voltage of both nMOS and pMOS devices in the range of |0.4-0.5| V. Devices with excellent Ion/Ioff behavior were obtained with reduced gate leakage values.
Keywords :
MOCVD coatings; MOSFET; hafnium compounds; titanium compounds; HfO2 gate stack; MOCVD; TiN; TiN-HfO2; gate leakage; nMOS; pMOS; triple-gate device; Hafnium oxide; Paper technology; Tin; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2005. Digest of Technical Papers. 2005 Symposium on
Print_ISBN :
4-900784-00-1
Type :
conf
DOI :
10.1109/.2005.1469231
Filename :
1469231
Link To Document :
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