Chip-package codesign of receiver front end modules for RF/wireless applications

In this document, we have shown the advantages of SoP using MCM-D technology as a solution for producing integrated parts for use in RF systems offers many significant advantages over more traditional technologies. In particular the size reductions and performance improvements possible allow product developers to meet more closely the requirements of the market place. The realization of complete receiver front end has demonstrated clearly the potential of this technology to integrate complex RF functions into small, single modules. This technology is demonstrated as a high performance and low cost packaging technology and will be a competitive technology in future RF/wireless SoP application.