AN EHF backplate design for airborne active phased array antennas

Author

Wong, H. ; Chang, S.S. ; Chang, D.C.D. ; Bretana, G.S. ; Hill, G.A. ; Ho, T.Q. ; Wong, M.N.

Author_Institution

Hughes Aircraft Co., El Segundo, CA, USA

fYear

1991

fDate

10-14 July 1991

Firstpage

1253

Abstract

An EHF array backplate design for use in airborne active phase array antennas is described. The backplate utilizes a multilayer substrate and reduced waveguide for signal routing, while a counterflow air cooling technique is used to cool the GaAs monolithic microwave integrated circuit (MMIC) active devices. The integrated design is characterized by temperature-coefficient-matched materials to insure a rigid, thermally stable structure.<>

Keywords

III-V semiconductors; MMIC; aircraft instrumentation; antenna phased arrays; cooling; gallium arsenide; microwave antennas; satellite links; EHF array backplate design; EHF backplate; GaAs; MMIC; airborne active phased array antennas; counterflow air cooling; integrated design; monolithic microwave integrated circuit; monolithic phased arrays; multilayer substrate; reduced waveguide for signal routing; semiconductors; temperature-coefficient-matched materials; thermally stable structure; Antenna arrays; Cooling; Gallium arsenide; MMICs; Microwave antenna arrays; Microwave devices; Microwave theory and techniques; Nonhomogeneous media; Phased arrays; Routing;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1991., IEEE MTT-S International

Conference_Location

Boston, MA, USA

ISSN

0149-645X

Print_ISBN

0-87942-591-1

Type

conf

DOI

10.1109/MWSYM.1991.147249

Filename

147249