DocumentCode
3552394
Title
Planar surface barrier diodes
Author
Bushinski, A.J. ; Lory, H.J. ; Chase, E.W.
Volume
11
fYear
1965
fDate
1965
Firstpage
57
Lastpage
57
Abstract
Substantial improvement in the reliability of the surface-barrier diode has been achieved by using planar techniques. The Kahng-Lepselter structure uses a multiple layer metal contact sealed to an overlay over the oxide. Both copper and palladium silicide diodes with titanium-platinum or "chromium-platinum overlays have survived 100 hour stress aging at 360°C in air and aging in one atmosphere of steam at 350°C on open headers.
Keywords
Aging; Breakdown voltage; Copper; Electric breakdown; Laboratories; Light emitting diodes; Palladium; Stress; Telephony; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1965 International
Type
conf
DOI
10.1109/IEDM.1965.187616
Filename
1474197
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