Title :
Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip chip bonding of GaAs-AlGaAs MQW modulators and detectors to silicon CMOS
Author :
Lentine, Anthony L. ; Goossen, K.W. ; Walker, James Alfred ; Chirovsky, L.M.F. ; D´Asaro, L.A. ; Hui, S.P. ; Tseng, B.T. ; Leibenguth, R.E. ; Cunningham, John E. ; Jan, W.Y. ; Kuo, J.M. ; Dahringer, D. ; Kossives, D. ; Bacon, D.D. ; Livescu, Gabriela ; Mo
Author_Institution :
AT&T Bell Labs., Naperville, IL, USA
Abstract :
Summary form only given. Optical interconnections between electronic devices is expected to alleviate the communication bottleneck that exists in today´s electronic switching and computing systems. A particularly attractive approach is to integrate the optical detectors and modulators or sources directly onto electronic circuitry. We believe we present the first high speed optoelectronic VLSI switching chip using this technology. The circuit has 4096 optical detectors, 256 optical modulators, 140 K FETs. The circuit implements 16 16/spl times/16 fully interconnected switches.
Keywords :
CMOS integrated circuits; III-V semiconductors; VLSI; aluminium compounds; electro-optical modulation; electro-optical switches; flip-chip devices; gallium arsenide; integrated optoelectronics; optical interconnections; photodetectors; semiconductor quantum wells; FETs; GaAs-AlGaAs; GaAs-AlGaAs MQW modulators; GaAs-AlGaAs MQW photodetectors; I/O based on flip chip bonding; communication bottleneck; electronic circuitry; electronic computing systems; electronic devices; electronic switching; fully interconnected switches; high speed optoelectronic VLSI switching chip; optical detectors; optical interconnections; optoelectronic VLSI switching chip; silicon CMOS; Bonding; Circuits; Communication switching; Flip chip; High speed optical techniques; Optical interconnections; Optical modulation; Quantum well devices; Silicon; Very large scale integration;
Conference_Titel :
Lasers and Electro-Optics, 1996. CLEO '96., Summaries of papers presented at the Conference on
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-55752-443-2