Bonding of beam lead integrated circuits

The development of the sealed-junction, beam-lead silicon integrated circuit permits new freedom in the assembly of complex functional circuits. Because of the intrinsic capabilities of this silicon device technology, handling, registering, and bonding techniques which are capable of achieving high yields at manufacturable rates are being developed. For the device, the beams are utilized as the prime elements for handling and registration of the chip to the pattern of conductors on a substrate. Requirements and procedures for these operations, are briefly described.