DocumentCode
3552670
Title
Multiple function linear microcircuits
Author
Hirschfeld, R.A.
Author_Institution
Amelco Semiconductor, Mountain View, Calif.
Volume
13
fYear
1967
fDate
1967
Firstpage
78
Lastpage
78
Abstract
While digital microcircuits are performing increasing numbers of independent logic functions on a single chip, the diversified requirements of the typical linear system have limited most linear circuits to one function per package. A first step toward large-scale integration of linear subsystems involves development of a basic module, which may be optimized through interconnection to perform the widely varying functions in an audio, servo or rf system. This approach is more efficient, and gives more optimized performance than interconnecting general-purpose single components on a chip. The second step requires that adjacent basic modules be interconnected, and packaged as a group.
Keywords
Crosstalk; Electric variables; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit packaging; Linear circuits; Linear systems; Logic functions; Semiconductor device packaging; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1967 International
Type
conf
DOI
10.1109/IEDM.1967.187837
Filename
1474918
Link To Document