• DocumentCode
    3552670
  • Title

    Multiple function linear microcircuits

  • Author

    Hirschfeld, R.A.

  • Author_Institution
    Amelco Semiconductor, Mountain View, Calif.
  • Volume
    13
  • fYear
    1967
  • fDate
    1967
  • Firstpage
    78
  • Lastpage
    78
  • Abstract
    While digital microcircuits are performing increasing numbers of independent logic functions on a single chip, the diversified requirements of the typical linear system have limited most linear circuits to one function per package. A first step toward large-scale integration of linear subsystems involves development of a basic module, which may be optimized through interconnection to perform the widely varying functions in an audio, servo or rf system. This approach is more efficient, and gives more optimized performance than interconnecting general-purpose single components on a chip. The second step requires that adjacent basic modules be interconnected, and packaged as a group.
  • Keywords
    Crosstalk; Electric variables; Integrated circuit interconnections; Integrated circuit noise; Integrated circuit packaging; Linear circuits; Linear systems; Logic functions; Semiconductor device packaging; Strips;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1967 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1967.187837
  • Filename
    1474918