DocumentCode :
3552697
Title :
Analysis of the I(V) characteristics of P+N π P+structures for the determination of hole velocity in silicon
Author :
Scharfetter, D.L. ; Seidel, T.E.
Author_Institution :
Bell Telephone Laboratories, Murray Hill, N. J.
fYear :
1967
fDate :
18-20 Oct. 1967
Firstpage :
102
Lastpage :
102
Abstract :
The method of obtaining the velocity field relation from the I(V) characteristics of P+FNπP+ structures is analyzed using detailed numerical techniques and semiquantitative analytic descriptions. RRN concluded from differential resistance measurements above punch-through that the velocity was saturated and gave 7.5 \\times 10^{6} cm/sec for 04\\times10^{5} < E < 1.1 \\times 10^{5} volts/cm. The differential resistance above puncil-through is composed of: first the space-charge resistance component considered by RRN and second, a term which has its origin in the spill-over of holes into the depleted region of the p+n junction. A detailed analysis of the spill-over shows that as the current is increased the built-in field of the p+n junction is markedly reduced, by neutralization of the depleted space charge. This effect, typically 20% of the total differential resistance, is a factor in the accuracy of the hole velocity. In independent experiments on p+pp+ structures, we have found that the velocity increases by ∼ 30% (to an accuracy of ±5%)over the range of fields in the RRN experiment. It is shown for the p+πp+ structure that the J(V) curve is rather insensitive to the v(E) relation and that a non-saturated velocity also fits the RRN experimental results. An additional correction to the space-charge resistance itself comes from the effect of a nonsaturated velocity.
Keywords :
Doping; Electrical resistance measurement; Etching; Germanium; Independent component analysis; Laboratories; Radiative recombination; Silicon; Surface treatment; Telephony;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1967 International
Conference_Location :
Washington, DC, USA
Type :
conf
DOI :
10.1109/IEDM.1967.187861
Filename :
1474942
Link To Document :
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