Packaging an X-band microwave integrated circuit

Packaging of a hermetically sealed X-band microwave integrated circuit module is described. The module is a complete receiver-transmitter, including dipole antenna, for phased array radar applications. The principal problem areas are: 1. Interconnections between microwave thin film ceramic circuit units within the module. 2. Mechanical space limitations, imposed largely by wavelength considerations. 3. Techniques for mounting the ceramic circuit units within the module. 4. External geometry which affects mounting and external connections. 5. Dissipation of heat.