Title :
High-yield-processed bipolar LSI arrays
Author :
Dingwall, A.G.F.
Author_Institution :
RCA Electronic Components, Somerville, N. J.
Abstract :
This paper describes the results of an engineering program for fabricating bipolar LSI arrays consisting of 100 to 200 gates from fixed interconnect masks. The arrays are high-speed ECL arithmetic registers to be used in the demonstration LIMAC (Large Integrated Monolithic Array Computer) for the Air Force. Special processing techniques were found to improve yields sufficiently to make direct fabrication of these complex devices practicable.
Keywords :
Ceramics; Electronic packaging thermal management; Fabrication; Integrated circuit packaging; Large scale integration; Semiconductor device packaging; Substrates; Surface resistance; Thermal force; Thermal resistance;
Conference_Titel :
Electron Devices Meeting, 1968 International
DOI :
10.1109/IEDM.1968.188009
