Thermal impedance of ceramic packages using beam-Lead IC chips

An integrated circuit package utilizing beam-lead sealed junction (BLSJ) silicon chips either singly or in multiple arrays consists of a ceramic (99.5% Al2O3) substrate with a thin film metallic conductor pattern. The beam-leaded chip (or chips) is thermocompression bonded to the metallizing pattern and coated with a silicone resin for protection from humidity and surface contamination. External leads are also TC bonded to the metallizing pattern for connection to the outside world.