• DocumentCode
    3552898
  • Title

    Thermal impedance of ceramic packages using beam-Lead IC chips

  • Author

    Hardwick, N.E.

  • Volume
    14
  • fYear
    1968
  • fDate
    1968
  • Firstpage
    82
  • Lastpage
    82
  • Abstract
    An integrated circuit package utilizing beam-lead sealed junction (BLSJ) silicon chips either singly or in multiple arrays consists of a ceramic (99.5% Al2O3) substrate with a thin film metallic conductor pattern. The beam-leaded chip (or chips) is thermocompression bonded to the metallizing pattern and coated with a silicone resin for protection from humidity and surface contamination. External leads are also TC bonded to the metallizing pattern for connection to the outside world.
  • Keywords
    Bonding; Ceramics; Conductive films; Impedance; Integrated circuit packaging; Metallization; Semiconductor thin films; Silicon; Substrates; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1968 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1968.188010
  • Filename
    1475535
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3552898