DocumentCode :
3553101
Title :
Silicon contact for area reduction of integrated circuits
Author :
Lin, H.C. ; Alexander, D.S.
Volume :
15
fYear :
1969
fDate :
1969
Firstpage :
126
Lastpage :
128
Abstract :
In the design of integrated circuits, the contacts are made smaller than the diffused semiconductor area. The reason for the smaller contact area is to avoid the contact of the metal to areas of opposite conductivity type to that of diffused area when misalignment occurs. Because aluminum is universally used as the interconnecting metal and the aluminum work function is comparable to that of silicon, an alloyed aluminum contact makes good ohmic connection with p-type silicon, but a leaky reverse junction with the n-type silicon. For n-channel MOS transistors, the situation is even worse because the alloyed aluminum in contact with p-type substrate would cause a short circuit.
Keywords :
Aluminum; Laboratories; Leakage current; MOS integrated circuits; MOSFETs; Metallization; Oxidation; Shape control; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1969 International
Type :
conf
DOI :
10.1109/IEDM.1969.188178
Filename :
1476059
Link To Document :
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