• DocumentCode
    3553101
  • Title

    Silicon contact for area reduction of integrated circuits

  • Author

    Lin, H.C. ; Alexander, D.S.

  • Volume
    15
  • fYear
    1969
  • fDate
    1969
  • Firstpage
    126
  • Lastpage
    128
  • Abstract
    In the design of integrated circuits, the contacts are made smaller than the diffused semiconductor area. The reason for the smaller contact area is to avoid the contact of the metal to areas of opposite conductivity type to that of diffused area when misalignment occurs. Because aluminum is universally used as the interconnecting metal and the aluminum work function is comparable to that of silicon, an alloyed aluminum contact makes good ohmic connection with p-type silicon, but a leaky reverse junction with the n-type silicon. For n-channel MOS transistors, the situation is even worse because the alloyed aluminum in contact with p-type substrate would cause a short circuit.
  • Keywords
    Aluminum; Laboratories; Leakage current; MOS integrated circuits; MOSFETs; Metallization; Oxidation; Shape control; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1969 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1969.188178
  • Filename
    1476059