DocumentCode
3553103
Title
A reliable contact for insulated gate effect integrated circuits
Author
Dudley, R.H. ; Labuda, E.F.
Author_Institution
Bell Telephone Laboratories, Allentown, Pa.
Volume
15
fYear
1969
fDate
1969
Firstpage
128
Lastpage
128
Abstract
Insulated gate field effect integrated circuits are economically attractive because of the number of functions possible per unit area and the relative simplicity of design and processing. In many applications, insulated gate field effect transistors (IGFET) with low (∼1 volt) and stable threshold voltages are required. Prior experience with conventional beam-lead technology (1) (platinum-silicide, titaniam, platinum, gold) in bipolar devices has demonstrated its high reliability. Expected high reliability combined with the economic advantages in mechanical handling, bonding, and compatibility with other technologies dictated the incorporation of beam-leads in IGFET circuits.
Keywords
Aluminum oxide; Dielectrics and electrical insulation; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit reliability; Jacobian matrices; Oxidation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1969 International
Type
conf
DOI
10.1109/IEDM.1969.188180
Filename
1476061
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