• DocumentCode
    3553103
  • Title

    A reliable contact for insulated gate effect integrated circuits

  • Author

    Dudley, R.H. ; Labuda, E.F.

  • Author_Institution
    Bell Telephone Laboratories, Allentown, Pa.
  • Volume
    15
  • fYear
    1969
  • fDate
    1969
  • Firstpage
    128
  • Lastpage
    128
  • Abstract
    Insulated gate field effect integrated circuits are economically attractive because of the number of functions possible per unit area and the relative simplicity of design and processing. In many applications, insulated gate field effect transistors (IGFET) with low (∼1 volt) and stable threshold voltages are required. Prior experience with conventional beam-lead technology (1) (platinum-silicide, titaniam, platinum, gold) in bipolar devices has demonstrated its high reliability. Expected high reliability combined with the economic advantages in mechanical handling, bonding, and compatibility with other technologies dictated the incorporation of beam-leads in IGFET circuits.
  • Keywords
    Aluminum oxide; Dielectrics and electrical insulation; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit reliability; Jacobian matrices; Oxidation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1969 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1969.188180
  • Filename
    1476061