DocumentCode :
3553103
Title :
A reliable contact for insulated gate effect integrated circuits
Author :
Dudley, R.H. ; Labuda, E.F.
Author_Institution :
Bell Telephone Laboratories, Allentown, Pa.
Volume :
15
fYear :
1969
fDate :
1969
Firstpage :
128
Lastpage :
128
Abstract :
Insulated gate field effect integrated circuits are economically attractive because of the number of functions possible per unit area and the relative simplicity of design and processing. In many applications, insulated gate field effect transistors (IGFET) with low (∼1 volt) and stable threshold voltages are required. Prior experience with conventional beam-lead technology (1) (platinum-silicide, titaniam, platinum, gold) in bipolar devices has demonstrated its high reliability. Expected high reliability combined with the economic advantages in mechanical handling, bonding, and compatibility with other technologies dictated the incorporation of beam-leads in IGFET circuits.
Keywords :
Aluminum oxide; Dielectrics and electrical insulation; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit reliability; Jacobian matrices; Oxidation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1969 International
Type :
conf
DOI :
10.1109/IEDM.1969.188180
Filename :
1476061
Link To Document :
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