Title :
A planar multi-layer interconnection
Abstract :
A new structure and fabrication method of multi-layer interconnections have been developed. The feature of this method lies in the use of an anodic oxidation technique instead of the conventional metal etching in the formation of interconnection patterns.
Keywords :
Aluminum oxide; Application specific integrated circuits; Chemicals; Etching; Integrated circuit interconnections; Large scale integration; Metallization; Oxidation; Semiconductor films; Temperature;
Conference_Titel :
Electron Devices Meeting, 1969 International
DOI :
10.1109/IEDM.1969.188181
