DocumentCode
3553192
Title
The corrosion resistance of several integrated-circuit metallization systems
Author
Cunningham, J.A. ; Fuller, C.R. ; Haywood, C.T.
Author_Institution
Texas Instruments Inc., Dallas, Texas
Volume
16
fYear
1970
fDate
1970
Firstpage
50
Lastpage
50
Abstract
Accelerated life data are presented on several integrated-circuit metallization systems including Al, Mo-Au, Ti-Pt-Au, and a new system W:Ti-Au, where the r-f-sputtered W:Ti layer is a pseudo-alloy of 10-20% Ti in W. Life tests include total water immersion, high-pressure steam, and 85°C/85% RH/bias on bare and plastic-encapsulated devices. Heat age and resistivity-ratio data are presented showing the metallurgical stability of the W:Ti-Au system. In order of decreasing corrosion resistance, Ti-Pt-Au > W:Ti-Au > > Mo-Au ≥ Al.
Keywords
Corrosion; Metallization;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1970 International
Type
conf
DOI
10.1109/IEDM.1970.188245
Filename
1476357
Link To Document