DocumentCode :
3553218
Title :
Polycrystalline silicon technology for bipolar integrated circuits
Author :
Schoeff, J.A.
Volume :
16
fYear :
1970
fDate :
1970
Firstpage :
74
Lastpage :
76
Abstract :
Polycrystalline silicon regions in the epitaxial layer of integrated circuits can perform isolation and buried-layer contact, and form surface elements such as field plates, capacitors, crossunders, and electrostatic shields. Recent experimental developments include new methods of selective growth and doping of these polycrystalline regions to provide very high voltage breakdown, low parasitic capacitance, and smooth surfaces with excellent pattern definition.
Keywords :
Bipolar integrated circuits; Capacitors; Dielectric breakdown; Doping; Electrostatics; Epitaxial layers; Integrated circuit technology; Isolation technology; Parasitic capacitance; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1970 International
Type :
conf
DOI :
10.1109/IEDM.1970.188268
Filename :
1476380
Link To Document :
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