DocumentCode :
3553639
Title :
"Planar punch-through characteristics"
Author :
Troutman, R.R.
Author_Institution :
IBM System Products Division, Essex Junction, Vermont
fYear :
1972
fDate :
4-6 Dec. 1972
Firstpage :
3
Lastpage :
3
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1972 International
Type :
conf
DOI :
10.1109/IEDM.1972.249226
Filename :
1477231
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3553639
