DocumentCode :
3553772
Title :
Bulk acoustic delay lines utilizing sub-micron platelet LiNbO3transducer
Author :
Huang, H.C. ; Knox, J.D. ; Turski, Z.
Author_Institution :
RCA Laboratories, Princeton, New Jersey
Volume :
19
fYear :
1973
fDate :
1973
Firstpage :
263
Lastpage :
265
Abstract :
This article describes the fabrication technology and preliminary results of a new generation of bulk acoustic delay lines. The approach being taken is to use magnesium aluminate spinel (MgAl2O4) as the delay medium and to fabricate shear wave transducers from bulk lithium niobate (LiNbO3). We have recently developed a technology for fabrication of sub-micron bulk platelet instead of thin film transducers. Lithium niobate transducers with thicknesses as thin as 0.2 µm have been achieved. This technology employs a novel bonding technique, the room temperature vacuum bond, and a carefully controlled process of ion beam milling. Bulk wave acoustic delay lines consisting of LiNbO3transducers on spinel substrate have yielded very wideband and low loss operation in S-, C- and X-band frequencies.
Keywords :
Acoustic transducers; Bonding; Delay lines; Fabrication; Lithium niobate; Magnesium; Propagation delay; Temperature control; Transistors; Vacuum technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1973 International
Type :
conf
DOI :
10.1109/IEDM.1973.188703
Filename :
1477580
Link To Document :
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