DocumentCode :
3553947
Title :
Chemical vapor deposition of tin oxide films
Author :
Baliga, Jayant B. ; Ghandhi, Sorab K.
Author_Institution :
General Electric Company, Schenectady, New York
Volume :
21
fYear :
1975
fDate :
1975
Firstpage :
105
Lastpage :
107
Abstract :
A new technique is described for the deposition of SnO2films based upon the pyrolysis of tetramethyltin (TMT) in oxygen at relatively low temperatures ( \\simeq 450\\deg c). As a source, TMT has the advantages of being stable in air and moisture, and of being a liquid with a relatively high vapor pressure at room temperature. Thus, a simple bubbler system is used to transport its vapors to the reaction chamber. The deposition technique is characterized by (1) high and controllable growth rates (more than 300 Å/min), (2) high conductivity layers (more than 30 Ω cm-1undoped), and (3) highly transparent layers in the visible range more than 95% transmission for 1500 Å layers). In addition, the films can be doped to achieve conductivities as high as 200 cm-1without loss in transmission. Finally, fast, effective low temperature anneals with forming gas in an open tube system can be used to result in a two-fold increase in conductivity.
Keywords :
Chemical vapor deposition; Conductive films; Conductivity; Glass; Inductors; Moisture; Semiconductor films; Substrates; Temperature distribution; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1975 International
Type :
conf
DOI :
10.1109/IEDM.1975.188836
Filename :
1478197
Link To Document :
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