Photoresists

A review of a chemistry of the three families of photoresist materials commonly used for fabrication of silicon integrated circuits will be presented. The influence of the chemical properties of these materials on the photolithographic processing steps of coating, baking, exposing and developing will be emphasized. Data will be presented on the characteristics of the newest members of these families of resists with respect to each of the photolithographic steps. The limitations of current materials with respect to the newer technologies of projection lithography and physical etching will be explored.