DocumentCode :
3554400
Title :
Device characteristics for poly I2L
Author :
Davies, Roderick D. ; Meindl, James D.
Author_Institution :
Xerox Palo Alto Research Center, Palo Alto, CA
Volume :
23
fYear :
1977
fDate :
1977
Firstpage :
170
Lastpage :
174
Abstract :
Maximizing I2L speed and efficiency while retaining linear-circuit (LIC) compatibility has received little attention; such is the specific goal of Poly I2L [1]. This paper describes the interaction of the Poly NPN and PNP devices with the compatible 15 to 30 volt LIC NPN and lateral PNP devices, and provides processing details. Experimental data is presented demonstrating the non-critical nature of the Poly I2L out-diffused NPN-base scheme. Minimum propagation delay analysis is done showing good agreement with experimental data. Comparable contributions to the ∼5 nsec delay arise from the NPN and the PNP devices, even for ∼7.5 µm PNP base (10 µm layout basewidth). Extrinsic efficiency is dominated by a peripheral component of base-emitter capacitance. The figure of merit [LIC BVCBO/I2L τmin] is defined and compared for standard and Poly I2L. Finally, it is shown that the previously recognized upper limit on epitaxial resistivity for I2L DC operation does not apply to Poly I2L.
Keywords :
Boron; Circuit testing; Conductivity; Diodes; Etching; Human computer interaction; Implants; Laboratories; Propagation delay; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1977 International
Type :
conf
DOI :
10.1109/IEDM.1977.189196
Filename :
1479276
Link To Document :
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