• DocumentCode
    3554437
  • Title

    The buried-source VMOS dynamic RAM device

  • Author

    Barnes, J.J. ; Shabde, S.N. ; Jenne, F.B.

  • Author_Institution
    American Microsystems, Inc., Santa Clara, CA
  • Volume
    23
  • fYear
    1977
  • fDate
    1977
  • Firstpage
    272
  • Lastpage
    276
  • Abstract
    The buried-source dynamic RAM device combines VMOS technology with the 1-transistor cell for a high performance and high density memory (1). This paper presents results of both experimental and theoretical analyses of the device as they apply to use in a 16K or 64K-bit dynamic RAM. The VMOST threshold voltage, breakdown voltage, weak inversion current, junction leakage current, and junction capacitance for both the forward and reverse mode of operation (reversal of source and drain) are experimentally related to the shape of the doping profile throughout the channel. Equations are developed for the VMOST short-channel threshold voltage and storage capacity of the cell. Finally, cell refresh data is presented that proves the operation of the device as a dynamic memory element.
  • Keywords
    Boron; Breakdown voltage; Capacitance; DRAM chips; Electric breakdown; Epitaxial growth; Random access memory; Substrates; Threshold voltage; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1977 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1977.189230
  • Filename
    1479310