• DocumentCode
    3554716
  • Title

    Hot-electron design constraints for one-micron IGFET´s

  • Author

    Ning, T.H. ; Cook, P.W. ; Dennard, R.H. ; Osburn, C.M. ; Schuster, S.E. ; Yu, H.N.

  • Author_Institution
    IBM Thomas J. Watson Research Center, Yorktown Heights, New York
  • Volume
    24
  • fYear
    1978
  • fDate
    1978
  • Firstpage
    472
  • Lastpage
    475
  • Abstract
    An approach is described for determining the hot-electron-limited voltages for silicon IGFET´s of small dimensions. The approach was followed in determining the room-temperature and the 77°K hot-electron-limited voltages for a device designed to have a minimum channel length of one micron. The substrate-hot-electron limits were determined from a verified empirical model. The channel-hot-electron limits were determined empirically from measurements of the injection current as a function of voltage and from long-term stress experiments. For the one-micron design considered, the channel-hot-electron limits are lower than the substrate-hot-electron limits. The maximum voltage, VGS=VDS, is 4.75 V at room temperature (25°C) and 3.5 V at 77°K. More details of the voltage limits as well as the approach for determining them are discussed. An example of a circuit designed to operate within these hot-electron voltage limits is also discussed.
  • Keywords
    Circuits; Current measurement; Electron emission; Electron traps; Insulation; Leakage current; Silicon; Stress measurement; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1978 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1978.189457
  • Filename
    1479882