Abstract :
The application of state-of-the-art bipolar I.C. device and process technologies to the fabrication of Schottky Transistor logic is discussed. The special requirements of a dual Schottky barrier-height metal system is reviewed and the performance and density of STL utilizing minimum features ranging from 5 µm to less than 1.5 µm is shown including minimum gate delays below .5 nsec and power-delay product below 50 femto-Joules. An example of an STL circuit implemented with an automatically routed gate array is shown.
Keywords :
Circuits; Clamps; Delay; Isolation technology; Leakage current; Logic devices; Schottky diodes; Switches; Temperature; Voltage;
Conference_Titel :
Electron Devices Meeting, 1979 Internationa
DOI :
10.1109/IEDM.1979.189615