DocumentCode
3554937
Title
An Mo gate 4K static MOS RAM
Author
Ishikawa, H. ; Yamamoto, M. ; Nakamura, T. ; Toyokura, N. ; Yanagawa, F. ; Kiuchi, K. ; Kondo, M.
Author_Institution
Fujitsu Laboratories Ltd., Kawasaki, Japan
Volume
25
fYear
1979
fDate
1979
Firstpage
358
Lastpage
361
Abstract
Performance of a 4K static RAM was improved significantly with utilization of low resistance molybdenum gate process instead of conventional poly-silicon gate process. A typical access time of 26 ns was achieved with a low power consumption of 250 mW when the RAM was operated at 5 V-supply voltage and TTL compatible I/O levels. A signal propagation delay along the word line of the RAM was quite small as a result of reduction in interconnection resistance. Several disadvantages of molybdenum gate process such as, heavy mobile ion contamination, large interface charges, high contact resistance between molybdenum and silicon were overcame by improving the fabrication technologies such as, forming gas annealing, protection film coating, and ion implantation.
Keywords
Annealing; Contact resistance; Contamination; Energy consumption; Fabrication; Propagation delay; Protection; Semiconductor films; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1979 Internationa
Type
conf
DOI
10.1109/IEDM.1979.189625
Filename
1480490
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