• DocumentCode
    3555329
  • Title

    Twin-tub CMOS - A technology for VLSI circuits

  • Author

    Parrillo, L.C. ; Payne, R.S. ; Davis, R.E. ; Reutlinger, G.W. ; Field, R.L.

  • Author_Institution
    Bell Laboratories, Murray Hill, New Jersey
  • Volume
    26
  • fYear
    1980
  • fDate
    1980
  • Firstpage
    752
  • Lastpage
    755
  • Abstract
    CMOS technology has been developed through several generations of design rules with an n-type substrate (where p-channel transistors were formed) and with a p-tub implanted and diffused region (where n-channel transistors were formed). In order to enable a separate optimization of both transistors and to utilize the dopant control available with implanted layers, a two-tub approach was adopted. Utilizing lightly doped epi on an n+substrate (for latch-up protection), nitride-masked self-aligned tubs, 1016cm-3surface doping and 600Å gate oxides, an 8-mask CMOS process (named \´Twin-Tub") was formulated. The combination of n on n+epi and careful I/O layout renders the circuits latch-up free. Novel aspects of the process, the devices it produces and finally the resultant circuit performance are herein described.
  • Keywords
    Aluminum; Boron; CMOS technology; Circuit optimization; Etching; Glass; Plasma applications; Plasma devices; Plasma properties; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1980 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1980.189946
  • Filename
    1481389