DocumentCode
3555329
Title
Twin-tub CMOS - A technology for VLSI circuits
Author
Parrillo, L.C. ; Payne, R.S. ; Davis, R.E. ; Reutlinger, G.W. ; Field, R.L.
Author_Institution
Bell Laboratories, Murray Hill, New Jersey
Volume
26
fYear
1980
fDate
1980
Firstpage
752
Lastpage
755
Abstract
CMOS technology has been developed through several generations of design rules with an n-type substrate (where p-channel transistors were formed) and with a p-tub implanted and diffused region (where n-channel transistors were formed). In order to enable a separate optimization of both transistors and to utilize the dopant control available with implanted layers, a two-tub approach was adopted. Utilizing lightly doped epi on an n+substrate (for latch-up protection), nitride-masked self-aligned tubs, 1016cm-3surface doping and 600Å gate oxides, an 8-mask CMOS process (named \´Twin-Tub") was formulated. The combination of n on n+epi and careful I/O layout renders the circuits latch-up free. Novel aspects of the process, the devices it produces and finally the resultant circuit performance are herein described.
Keywords
Aluminum; Boron; CMOS technology; Circuit optimization; Etching; Glass; Plasma applications; Plasma devices; Plasma properties; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1980 International
Type
conf
DOI
10.1109/IEDM.1980.189946
Filename
1481389
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