DocumentCode
3555439
Title
Aluminum thermomigration technology for 3-dimensional integrated circuits
Author
Lee, J.Y.M. ; Brown, R.H. ; Etchells, R.D. ; Grinberg, J. ; Nudd, G.R. ; Nygaar, P.A.
Author_Institution
Hughes Research Laboratories, Malibu, California
Volume
27
fYear
1981
fDate
1981
Firstpage
66
Lastpage
66
Keywords
Aluminum; Crystals; Etching; Geometry; Integrated circuit technology; Laboratories; Microelectronics; Silicon; Solids; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1981 International
Type
conf
DOI
10.1109/IEDM.1981.190000
Filename
1481953
Link To Document