DocumentCode :
3555439
Title :
Aluminum thermomigration technology for 3-dimensional integrated circuits
Author :
Lee, J.Y.M. ; Brown, R.H. ; Etchells, R.D. ; Grinberg, J. ; Nudd, G.R. ; Nygaar, P.A.
Author_Institution :
Hughes Research Laboratories, Malibu, California
Volume :
27
fYear :
1981
fDate :
1981
Firstpage :
66
Lastpage :
66
Keywords :
Aluminum; Crystals; Etching; Geometry; Integrated circuit technology; Laboratories; Microelectronics; Silicon; Solids; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1981 International
Type :
conf
DOI :
10.1109/IEDM.1981.190000
Filename :
1481953
Link To Document :
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