• DocumentCode
    3555701
  • Title

    Groundbounce in ASIC´s: model and test results

  • Author

    Diaz-Olavarrieta, Liliana

  • Author_Institution
    Bell Northern Res., Ottawa, Ont., Canada
  • fYear
    1991
  • fDate
    12-16 Aug 1991
  • Firstpage
    387
  • Lastpage
    392
  • Abstract
    Groundbounce is the noise produced by simultaneous switching of drivers in an ASIC, due to excessive current drawn from the power supply at the time of switching. This noise may cause delay and false triggering problems at the functional level, as well as emissions problems due to the fast rise time and amplitude of current spikes induced. Test results which attest to the seriousness of the groundbounce problem in large ASICs are presented. The importance of the positioning of switching drivers as a factor in reducing groundbounce is discussed. The model of groundbounce is detailed to include layout and package parameters, in order to more accurately calculate the effective inductance value to be used for predictions. The results presented correspond to groundbounce voltages measured in one test chip mounted on a PGA package
  • Keywords
    application specific integrated circuits; driver circuits; electric noise measurement; electron device noise; integrated circuit testing; switching circuits; ASIC; PGA package; current spikes; groundbounce; induced current amplitude; inductance; layout; model; noise; package parameters; power supply; rise time; switching drivers; test chip; test results; Application specific integrated circuits; Delay effects; Inductance; Noise level; Packaging; Power supplies; Predictive models; Semiconductor device measurement; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1991. Symposium Record., IEEE 1991 International Symposium on
  • Conference_Location
    Cherry Hill, NJ
  • Print_ISBN
    0-7803-0158-7
  • Type

    conf

  • DOI
    10.1109/ISEMC.1991.148261
  • Filename
    148261