DocumentCode :
3555856
Title :
Reduced geometry CMOS technology
Author :
Jerdonek, Ronald ; Ghezzo, Mario ; Weaver, Jim ; Combs, Steve
Author_Institution :
General Electric Corporate Research and Development Center, Schenectady, New York
Volume :
28
fYear :
1982
fDate :
1982
Firstpage :
450
Lastpage :
453
Abstract :
In this presentation, the authors review bulk silicon CMOS evolution and discuss the suitability of scaling CMOS to one micron features. Characterization data from one micron twin-tub processes fabricated on both n and p-type starting material will be reviewed. These data include latch-up sensitivity of the technology in which the dramatic improvement achievable with retrograde implantation will be highlighted. The outstanding performance achievable with reduced geometry will be emphasized with data obtained from a dual modulus prescaler which has operated at clock rates in excess of 1 Ghz at 5 volts.
Keywords :
CMOS process; CMOS technology; Clocks; Doping; Fabrication; Geometry; MOS devices; Random access memory; Research and development; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1982 International
Type :
conf
DOI :
10.1109/IEDM.1982.190322
Filename :
1482856
Link To Document :
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