DocumentCode :
3555896
Title :
Submicron GaAs vertical electron transistor
Author :
Mishra, U. ; Kohn, E. ; Eastman, L.F.
Author_Institution :
Cornell University, Ithaca, NY
Volume :
28
fYear :
1982
fDate :
1982
Firstpage :
594
Lastpage :
597
Abstract :
To achieve high frequency performance in a transistor, along with low parasitics, the intrinsic device should have very low transit time of carriers from source to the drain. We report on the fabrication and D.C. characterization of vertical transistors with 0.5 \\\\mu m drain to source spacing and with sub- \\\\mu m channel widths. A gmof 81 mS/mm was achieved in the devices doped at 5 \\times 10^{16} cm-3and 47 mS/mm in those doped at 7 \\times 10^{15} cm-3. We propose this structure as a convenient method of studying the influence of near-ballistic electron motion on transistor performance.
Keywords :
Electrons; Etching; Fabrication; Fingers; Frequency; Gallium arsenide; Gold; Metallization; Neodymium; Ohmic contacts;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1982 International
Type :
conf
DOI :
10.1109/IEDM.1982.190362
Filename :
1482896
Link To Document :
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