DocumentCode
3555910
Title
700 Å Gate length buried channel Silicon MOSFET´s
Author
Swartz, R.G. ; Howard, R.E. ; Jackel, L.D. ; Grabbe, P. ; Epworth, R.W. ; Tennant, D.M. ; Archer, V.D.
Author_Institution
Bell Telephone Laboratories, Holmdel, NJ
fYear
1982
fDate
13-15 Dec. 1982
Firstpage
642
Lastpage
645
Abstract
Buried channel silicon MOSFETs with gate lengths as small as 700 Å have been fabricated using high-resolution electron-beam lithography, multilayer resists, reactive-ion etching, and low temperature processing. In this paper we describe the variations of I-V characteristic, transconductance, pinch-off voltage, and output resistance as a function of gate length.
Keywords
Electrons; Fabrication; Implants; Lithography; MOSFETs; Metallization; Oxidation; Predictive models; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1982 International
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/IEDM.1982.190375
Filename
1482909
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