Overview of device characterization software for VLSI bipolar devices

In this paper we present a software package for calculating the SPICE II Gummel-Poon modeling parameters for BJT device structures encountered in VLSl IC´s directly from mask geometry and diffusion profiles. This software effectively bridges the gap between process design and device characterization. The heart of the software package uses sophisticated 1, 2 and quasi 3 dimensional device simulator programs in which carrier transport equations are solved by employing a hybrid solution technique. By partitioning the simulator into 4 sections, SPICE II modeling parameters can be obtained very quickly for a set process and specified mask geometry.