• DocumentCode
    3555928
  • Title

    Design and fabrication of p-channel FET for 1- µm CMOS technology

  • Author

    Hu, G.J. ; Ting, C.Y. ; Taur, Y. ; Dennard, R.H.

  • Author_Institution
    IBM Thomas J. Watson Research Center, Yorktown Heights, NY
  • fYear
    1982
  • fDate
    13-15 Dec. 1982
  • Firstpage
    710
  • Lastpage
    713
  • Abstract
    A retrograde n-well is shown to be good for 1-µm bulk CMOS technology using n+polysilicon gates. P-Channel FET´s with a threshold voltage of -0.6V fabricated in a retrograde n-well show small short-channel threshold lowering and good turn-off characteristics. In these devices thermally formed TiSi2is self-aligned to the shallow (0.3 µm) source/drain region to reduce the sheet resistance to 4 ohms/square. Because contact resistance from TiSi2to p+is a dominant factor in the total parasitic resistance from metal to the FET channels, high surface doping concentration of S/D regions is still preferred.
  • Keywords
    Boron; CMOS technology; Contact resistance; Doping; FETs; Fabrication; Implants; Surface resistance; Thermal resistance; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1982 International
  • Conference_Location
    San Francisco, CA, USA
  • Type

    conf

  • DOI
    10.1109/IEDM.1982.190393
  • Filename
    1482927