Title :
Design and fabrication of p-channel FET for 1- µm CMOS technology
Author :
Hu, G.J. ; Ting, C.Y. ; Taur, Y. ; Dennard, R.H.
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Abstract :
A retrograde n-well is shown to be good for 1-µm bulk CMOS technology using n+polysilicon gates. P-Channel FET´s with a threshold voltage of -0.6V fabricated in a retrograde n-well show small short-channel threshold lowering and good turn-off characteristics. In these devices thermally formed TiSi2is self-aligned to the shallow (0.3 µm) source/drain region to reduce the sheet resistance to 4 ohms/square. Because contact resistance from TiSi2to p+is a dominant factor in the total parasitic resistance from metal to the FET channels, high surface doping concentration of S/D regions is still preferred.
Keywords :
Boron; CMOS technology; Contact resistance; Doping; FETs; Fabrication; Implants; Surface resistance; Thermal resistance; Threshold voltage;
Conference_Titel :
Electron Devices Meeting, 1982 International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/IEDM.1982.190393