HISETS: A software system for designing semiconductor device packages

HISETS (Hitachi Semiconductor Thermal Strength Design System), a software system for designing semiconductor device packages was developed. Five programs are linked together to form a unified analysis of six important package design characteristics; (1) Thermal resistance, (2) Thermal deformation, (3) Thermal stress, (4) Heat resistance of chips and substrates, (5) Life of bonding layer, and (6) Change in electrical characteristics due to stress. An appropriate structure can be quickly obtained by simulating the revision of a structure until calculated results satisfy desired specifications.