DocumentCode :
3556100
Title :
A fully-self-aligned joint-gate CMOS technology
Author :
Robinson, A.L. ; Antoniadis, D.A. ; Maby, E.W.
Author_Institution :
Massachusetts Institute of Technology, Cambridge, MA
Volume :
29
fYear :
1983
fDate :
1983
Firstpage :
530
Lastpage :
533
Abstract :
A six-mask process that provides joint-gate CMOS structures with the source and drain of both transistors self-aligned to the joint-gate electrode has been developed. The features that permit the full self-alignment are an edge-defined silicon nitride "filament" (used as an oxidation mask) and overlapping polysilicon "handles" used to form the top transistor source and drain regions. The structures have been characterized as individual nMOS and pMOS transistors and are functional as joint-gate CMOS inverters.
Keywords :
CMOS technology; Doping; Electrodes; Etching; Implants; Oxidation; Plasma applications; Protection; Silicon; Sulfur hexafluoride;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1983 International
Type :
conf
DOI :
10.1109/IEDM.1983.190560
Filename :
1483685
Link To Document :
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