DocumentCode
3556296
Title
Technology requirements for mega bit CMOS EPROMs
Author
Yoshikawa, Kuniyoshi ; Sato, Maski ; Mori, Seiichi ; Mikata, Yu-ichi ; Yanase, Toshinoby ; Kanzaki, K. ; Nozawa, Hiroshi
Author_Institution
Toshiba Corporation, Kawasaki, Japan
Volume
30
fYear
1984
fDate
1984
Firstpage
456
Lastpage
459
Abstract
New technologies inherent to EPROM structure have been developed and discussed for realizing mega bit CMOS EPROMs. We have introduced three key technologies: (i) DI2DSA structure for high speed write/read characteristics, (ii) oxide film by argon diluted oxygen oxidation and/or polyoxide/nitride/oxide structures for thin reliable 2nd gate insulator, (iii) masked LDD structure for hot carrier resistance and high breakdown voltage. These technologies are considered to be promising for future advanced EPROMs.
Keywords
Boron; CMOS technology; EPROM; Hot carriers; Impurities; Insulation; Integrated circuit technology; Nonvolatile memory; Testing; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1984 International
Type
conf
DOI
10.1109/IEDM.1984.190750
Filename
1484521
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