DocumentCode
3556487
Title
A 600 ° C process for MOSFET fabrication using microwave plasma-stream gate oxidation
Author
Warabisako, T. ; Kimura, S. ; Tokuyama, T.
Author_Institution
Hitachi Ltd., Kokubunji, Japan
fYear
1985
fDate
1-4 Dec. 1985
Firstpage
216
Lastpage
219
Abstract
Among the current Si LSI fabrication processes, gate oxidation is one which is hard to replace with any low temperature alternatives. A novel oxidation technique using microwave plasma-stream can provide a promising oxide film at reduced temperatures. Application of this technique to the gate oxidation of MOSFET´s together with the possibility of fabricating devices at as low as 600°C is discussed.
Keywords
Diodes; Fabrication; MOSFET circuits; Oxidation; Plasma confinement; Plasma density; Plasma immersion ion implantation; Plasma temperature; Plasma waves; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1985 International
Conference_Location
Washington, DC, USA
Type
conf
DOI
10.1109/IEDM.1985.190934
Filename
1485484
Link To Document