DocumentCode
3556492
Title
Modified LDD device structures for VLSI
Author
Bampi, S. ; Plummer, J.D.
Author_Institution
Stanford University, Stanford, CA
Volume
31
fYear
1985
fDate
1985
Firstpage
234
Lastpage
237
Abstract
In LDD-like MOSFET structures previously studied [1-3], narrow, self-aligned
regions are introduced between the channel and the
source-drain regions. In this paper we describe a new n-MOS device structure which attempts to overcome some of the reliability problems [4] of LDD devices. Instead of a pure
region, we introduce a short-channel JFET under the sidewall oxide at the drain end in series with the intrinsic MOSFET as shown in Fig.1. Both 2-D device simulations and experimental results are shown to demonstrate the operation of this device and its potential for VLSI applications.
regions are introduced between the channel and the
source-drain regions. In this paper we describe a new n-MOS device structure which attempts to overcome some of the reliability problems [4] of LDD devices. Instead of a pure
region, we introduce a short-channel JFET under the sidewall oxide at the drain end in series with the intrinsic MOSFET as shown in Fig.1. Both 2-D device simulations and experimental results are shown to demonstrate the operation of this device and its potential for VLSI applications.Keywords
Circuit simulation; Design optimization; Hot carriers; Integrated circuit reliability; Laboratories; MOSFET circuits; Maintenance; Surface resistance; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1985 International
Type
conf
DOI
10.1109/IEDM.1985.190939
Filename
1485489
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