DocumentCode
3556536
Title
Two-dimensional silicon oxidation experiments and theory
Author
Kao, Dah-bin ; McVittie, James P. ; Nix, William D. ; Saraswat, Krishna C.
Author_Institution
Stanford University, Stanford, CA
Volume
31
fYear
1985
fDate
1985
Firstpage
388
Lastpage
391
Abstract
The effect of stress on the growth rate in 2-D Si oxidation has been clearly observed and characterized. It will be quantitatively demonstrated that the oxidation of curved Si surfaces is retarded by the stress associated with the nonplanar viscous deformation of the oxide, and that the retardation is more severe on concave structures than on convex structures. This result is based on an unique experimental approach in which extensive data was collected on the oxidation of cylindrical silicon structures of controlled radii of curvature. A theoretical model is developed based on the premise that the viscous stress normal to the Si surface is responsible for the retarded oxide growth, and that the stress in the bulk of the oxide is responsible for the difference between concave and convex structures.
Keywords
Laboratories; MOS capacitors; MOS devices; Materials science and technology; Numerical simulation; Oxidation; Silicon; Stress; Surface fitting; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1985 International
Type
conf
DOI
10.1109/IEDM.1985.190982
Filename
1485532
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