• DocumentCode
    3556569
  • Title

    Latchup-free CMOS structure using shallow trench isolation

  • Author

    Niitsu, Y. ; Taguchi, S. ; Shibata, K. ; Fuji, H. ; Shimamune, Y. ; Iwai, H. ; Kanzaki, K.

  • Author_Institution
    Toshiba Corporation, Kawasaki, Japan
  • Volume
    31
  • fYear
    1985
  • fDate
    1985
  • Firstpage
    509
  • Lastpage
    512
  • Abstract
    Using a shallow trench and a thin epitaxial layer, latchup-free CMOS has been realized. When the trench depth is 1.4 µm and the epitaxial layer thickness is 2 µm, the latchup holding voltage, VHis higher than 13 V. The mechanism of VHincrease is discussed using an equivalent circuit including the reverse transistors of the parasitic bipolar transistors. The interruption of lateral current flow with the trench contributes to VHincrease. From the results, it is well expected that the only about 1 µm deep trench must be adequate for achieving VHhigher than the supply voltage, i.e. 5V, and that the fabrication process of trench isolation becomes more reliable and easier.
  • Keywords
    Boron; Circuit testing; Epitaxial layers; Etching; Isolation technology; Power supplies; Semiconductor devices; Substrates; Thyristors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1985 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1985.191015
  • Filename
    1485565