DocumentCode
3556569
Title
Latchup-free CMOS structure using shallow trench isolation
Author
Niitsu, Y. ; Taguchi, S. ; Shibata, K. ; Fuji, H. ; Shimamune, Y. ; Iwai, H. ; Kanzaki, K.
Author_Institution
Toshiba Corporation, Kawasaki, Japan
Volume
31
fYear
1985
fDate
1985
Firstpage
509
Lastpage
512
Abstract
Using a shallow trench and a thin epitaxial layer, latchup-free CMOS has been realized. When the trench depth is 1.4 µm and the epitaxial layer thickness is 2 µm, the latchup holding voltage, VH is higher than 13 V. The mechanism of VH increase is discussed using an equivalent circuit including the reverse transistors of the parasitic bipolar transistors. The interruption of lateral current flow with the trench contributes to VH increase. From the results, it is well expected that the only about 1 µm deep trench must be adequate for achieving VH higher than the supply voltage, i.e. 5V, and that the fabrication process of trench isolation becomes more reliable and easier.
Keywords
Boron; Circuit testing; Epitaxial layers; Etching; Isolation technology; Power supplies; Semiconductor devices; Substrates; Thyristors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1985 International
Type
conf
DOI
10.1109/IEDM.1985.191015
Filename
1485565
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