1800V bipolar-mode MOSFETs: A first application of silicon wafer direct bonding (SDB) technique to a power device

1800v and 1700v non-latch-up Bipolar-Mode MOSFETs have been developed, based on Silicon Wafer Direct Bonding (SDB) technique: a new substrate wafer fabrication process superior to conventional epitaxy. The SDB technique easily realizes an optimum N buffer structure as well as a high resistivity N^-layer. Self-aligned deep P⁺diffusions, densified hole bypasses and an amorphous silicon resistive field plate have been implemented. 0.45µsec fall-time and more than 100A maximum current capability have been successfully realized.