• DocumentCode
    3556817
  • Title

    Single event charge collection modeling in CMOS multi-junctions structure

  • Author

    Chern, J.H. ; Seitchik, J.A. ; Yang, P.

  • Author_Institution
    Texas Instruments, Inc.
  • Volume
    32
  • fYear
    1986
  • fDate
    1986
  • Firstpage
    538
  • Lastpage
    541
  • Abstract
    Simulation was utilized to enable the study of the time dependent carrier and potential distributions that occur following the impact of heavy ion in multi-junction structures associated with CMOS technology. These simulations reveal a charge collection process which is quite complex However, the process can be more readily understood in it is broken into phases in which only a few mechanisms dominate the overall behavior. These phases, denoted the funneling phase and bipolar phase, can be represented by simple analytic models. The quantitative predictions of this model are shown to compare well with simulations.
  • Keywords
    CMOS technology; Circuit simulation; Conductivity; Instruments; Predictive models; Process design; Semiconductor device modeling; Semiconductor process modeling; Substrates; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1986 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1986.191242
  • Filename
    1486500